Microtensile Bond Strength of Different Bonding Agents to Superficial and Deep Dentin in Etch-and-Rinse and Self-Etch Modes

  • Atefe Sharifian Dental Materials Research Center, Faculty of Dentistry, Babol University of Medical Sciences, Babol, Iran
  • Behnaz Esmaeili Dental Materials Research Center, Health Research Institute, Babol University of Medical Sciences, Babol, Iran
  • Hemmat Gholinia Health Research Institute, Babol University of Medical Sciences, Babol, Iran.
  • Fariba Ezoji Dental Materials Research Center, Health Research Institute, Babol University of Medical Sciences, Babol, Iran
Keywords: Composite Resins; Dentin-Bonding Agents; Dentin

Abstract

Objectives: This study aimed to assess the microtensile bond strength (µTBS) of etch-and-rinse (E&R), self-etch (SE), and universal adhesives to superficial and deep dentin.

Materials and Methods: In this in vitro study, 40 sound third molars were randomly divided into two main groups of superficial and deep dentin. Based on our classification, superficial dentin was right beneath the deepest occlusal groove, and deep dentin was 2mm beneath the deepest occlusal groove. Each group was divided into 4 subgroups (n=20) for application of Adper Single Bond 2 (ASB), Clearfil SE Bond (CSE), and Scotchbond Universal (SBU) in E&R and SE modes along with Charisma Smart composite resin on dentin. The specimens were incubated in distilled water at 37°C for 24 hours and their µTBS was then measured. The mode of failure was determined under a stereomicroscope at ×40 magnification. Data were analyzed by one-way ANOVA (alpha=0.05).

Results: The highest µTBS belonged to the superficial dentin/SBU/E&R group. The µTBS was significantly higher in superficial dentin than deep dentin for all adhesives (P=0.005). There was no significant difference in mode of failure among the groups.

Conclusion: Based on the results obtained in the present study, type of bonding agent and application mode affected µTBS. In use of universal adhesive, E&R mode can improve µTBS.

Published
2023-05-02
Section
Articles