Performance Evaluation of a Thermoelectric Refrigeration-Based Liquid Cooling Garment under Different Ambient Temperatures

Abstract

Introduction: Heat stress is regarded as one of the major physical hazards in high-temperature work settings.  Wearingcooling garments is one of the effective methods to reduce the negative impacts of such situations and enhance safety and performance in the environment.  Among the various types of cooling garments, liquid cooling garments (LCGs) are recognized as one of the most efficient options for managing heat stress. However, existing LCG designs encounter several challenges in terms of design and performance that require further improvement.

Material And Methods: In this study, a portable liquid cooling garment based on thermoelectric refrigeration technology was designed and developed. The cooling system’s efficiency in regulating  temperature and humidity within the microclimate—the space between the skin surface and the garment—was evaluated under various ambient temperature conditions.

Results: The results indicated that the cooling garment could deliver consistentcooling throughout the body surface and significantly lower microclimate temperature. At ambient temperatures of 31°C, 35°C, and 39°C, the microclimate temperatures recorded were 27.2°C, 30.1°C, and 32.4°C, respectively. Moreover, the cooling system reduced microclimate humidity by up to 7% compared to its inactive state.

Conclusion: The findings of this study show that the liquid cooling garment utilizing semiconductor refrigeration can effectively enhance the body's thermal conditions in high-tempreture settings. Utilizing this type of garment in work enviornments with heat stress can significantly contribute in lowering thermal strain and enhancing users' thermal comfort. However, further research in this field remains essential.